Significantly faster switching speeds which improve efficiency, support faster microprocessor speeds and reduce the size of passive components and overall equipment size;

Dramatically improved Figure of Merit (FOM) of the JBSFET^TM that allows manufacturers to place more components in the same unit area and utilize next generation processors for performance improvements; and

Standard industry-wide accepted packages such as the S08, MLF, TSSOP, DPAK and TO220 packages allow for quick starts at targeted customers.